Geckos Inspire New Method to Print Electronics on Complex Surfaces
ScienceDaily (Sep. 21, 2010) — Geckos are masters at sticking to surfaces of all kinds and easily unsticking themselves, too. Inspired by these lizards, a team of engineers has developed a reversible adhesion method for printing electronics on a variety of tricky surfaces such as clothes, plastic and leather.
Gecko feet clinging on glass. Geckos are masters at sticking to surfaces of all kinds and easily unsticking themselves, too. Inspired by these lizards, a team of engineers has developed a reversible adhesion method for printing electronics on a variety of tricky surfaces such as clothes, plastic and leather. (Credit: iStockphoto/Stephan Hoerold)
Researchers from Northwestern University and the University of Illinois at Urbana-Champaign designed a clever square polymer stamp that allows them to vary its adhesion strength. The stamp can easily pick up an array of electronic devices from a silicon surface and move and print them on a curved surface.
The research will be published Sept. 20 by the Proceedings of the National Academy of Sciences (PNAS).
"Our work proposes a very robust method to transfer and print electronics on complex surfaces," said Yonggang Huang, Joseph Cummings Professor of Civil and Environmental Engineering and Mechanical Engineering at Northwestern's McCormick School of Engineering and Applied Science.
Huang, co-corresponding author of the PNAS paper, led the theory and design work at Northwestern. His colleague John Rogers, the Flory-Founder Chair Professor of Materials Science and Engineering at the University of Illinois, led the experimental and fabrication work. Rogers is a co-corresponding author of the paper.
The research will be published Sept. 20 by the Proceedings of the National Academy of Sciences (PNAS).
"Our work proposes a very robust method to transfer and print electronics on complex surfaces," said Yonggang Huang, Joseph Cummings Professor of Civil and Environmental Engineering and Mechanical Engineering at Northwestern's McCormick School of Engineering and Applied Science.
Huang, co-corresponding author of the PNAS paper, led the theory and design work at Northwestern. His colleague John Rogers, the Flory-Founder Chair Professor of Materials Science and Engineering at the University of Illinois, led the experimental and fabrication work. Rogers is a co-corresponding author of the paper.
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Microstructured elastomeric surfaces withreversible adhesion and examples of theiruse in deterministic assembly by transferprinting
Seok Kim a, Jian Wu b,1, Andrew Carlson a,1, Sung Hun Jin a, Anton Kovalsky a, Paul Glass c, Zhuangjian Liu d, Numair Ahmed e, Steven L. Elgan e, Weiqiu Chen f, Placid M. Ferreira e, Metin Sitti g, Yonggang Huang b,2, and John A. Rogers a,2
-Author Affiliations
Seok Kim a, Jian Wu b,1, Andrew Carlson a,1, Sung Hun Jin a, Anton Kovalsky a, Paul Glass c, Zhuangjian Liu d, Numair Ahmed e, Steven L. Elgan e, Weiqiu Chen f, Placid M. Ferreira e, Metin Sitti g, Yonggang Huang b,2, and John A. Rogers a,2
-Author Affiliations
aDepartment of Materials Science and Engineering, Beckman Institute,and Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801;
bDepartment of Civil and Environmental Engineering and Department ofMechanical Engineering, Northwestern University, Evanston, IL 60208;
cDepartment of Biomedical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213;
dInstitute of High Performance Computing, Singapore 138632;
eDepartment of Mechanical Science and Engineering, University ofIllinois at Urbana-Champaign, Urbana, IL 61801;
fDepartment of Engineering Mechanics, Zhejiang University, Hangzhou, Zhejiang, China 310027; and
gDepartment of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA 15213
Edited by George M. Whitesides, Harvard University, Cambridge, MA, and approved August 10, 2010 (received for review April 27, 2010)
↵1J.W. and A.C. contributed equally to this work.
Abstract
Reversible control of adhesion is an important feature of many desired, existing, and potential systems, including climbing robots, medical tapes, andstamps for transfer printing. We present experimental and theoretical studiesof pressure modulated adhesion between flat, stiff objects and elastomericsurfaces with sharp features of surface relief in optimized geometries. Here, the strength of nonspecific adhesion can be switched by more than three ordersof magnitude, from strong to weak, in a reversible fashion. Implementing these concepts in advanced stamps for transfer printing enables versatile modes fordeterministic assembly of solid materials in micro/nanostructured forms. Demonstrations in printed two- and three-dimensional collections of silicon platelets and membranes illustrate some capabilities. An unusual type oftransistor that incorporates a printed gate electrode, an air gap dielectric, and an aligned array of single walled carbon nanotubes provides a device example.
biomimetic dry adhesion elastomeric stamp flexible electronics microelectromechanical systems
Footnotes
2To whom correspondence may be addressed. E-mail: jrogers@uiuc.edu andy-huang@northwestern.edu.
Author contributions: S.K., P.M.F., M.S., Y.H., and J.A.R. designed research; S.K., J.W., A.C., S.H.J., A.K., P.G., N.A., S.L.E., and W.C. performed research; S.K., J.W., A.C., S.H.J., Z.L., P.M.F., M.S., Y.H., and J.A.R. analyzed data; andS.K., J.W., A.C., S.H.J., P.M.F., M.S., Y.H., and J.A.R. wrote the paper.
The authors declare no conflict of interest.
This article is a PNAS Direct Submission.
This article contains supporting information online at
Author contributions: S.K., P.M.F., M.S., Y.H., and J.A.R. designed research; S.K., J.W., A.C., S.H.J., A.K., P.G., N.A., S.L.E., and W.C. performed research; S.K., J.W., A.C., S.H.J., Z.L., P.M.F., M.S., Y.H., and J.A.R. analyzed data; andS.K., J.W., A.C., S.H.J., P.M.F., M.S., Y.H., and J.A.R. wrote the paper.
The authors declare no conflict of interest.
This article is a PNAS Direct Submission.
This article contains supporting information online at
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